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Name: Zia Karim
Company Name: Yield Engineering Systems
Location: San Francisco Bay Area, California
Years In Industry: 25+
Consulting Specialties:
- Nadcap, NDT & Failure Analysis
- Heat Treating & Chem Processing
- Semiconductors
- R&D, Product Management
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Send an email | Website | Phone: 561-688-9434
Briefly:
Zia Karim co-founded Heat Treat Professionals Inc in 2002 with Adeel Karim to assist suppliers with Nadcap failures, initial accreditation, training, procedure writing, and NCR response support, particularly as it intersects with aerospace heat treating and forging specifications related to heat treating. Dr. Karim’s experience and measurable success in both engineering and business include noteworthy accomplishments in semiconductor fabrication. He is recognized as an expert in Nadcap for heat treating, having worked as Nadcap senior staff engineer for 10 years, holding that position longer than anyone else before or since. Currently, Dr. Karim is Chief Marketing Officer and Senior Vice President of Business Development and Strategic Marketing at YES. Dr. Karim most recently was Vice President of Business Development and Technology at Eugenus/AIXTRON/Genus (acquisitions) for over 15 years. He has also held senior management positions at Applied Materials and Novellus (acquired by Lam Research) after he started his career in Sharp Microelectronics in 1994. Dr. Karim received his Ph.D., in EE from Dublin City University in Ireland. An excellent business manager and executive, he has expertise in assessing competition, effectively retaining company market share, developing new technology, penetrating existing markets and managing customer loyalty. He is dedicated to advancing understanding in the field of semiconductor fabrication.
Publications or Significant Accomplishments:
- Founder of two business groups: Pioneer Trading Corporation (1992) and Heat Treat Professionals (2002).
- Established alliances and transitioned Boeing and other aerospace giants to Nadcap requirement protocol and accreditation status. (2002)
- Organized and moderated “III-V on Si” Seminars jointly with Sematech at every pre-IEDM from 2006 to 2012.
- Featured Speaker at several industry-related events around the world, such as IEEE Bangladesh on “New High-End Processing Technologies: From New Memories to High Mobility Channels” (2013); UC Berkeley Seminar: Solid State Technology and Devices: Micro/Nano Electro Mechanical Systems (MEMS) (2015)
- Took a pioneering role in positioning III-V MOCVD process for High Mobility Channel Applications in Semiconductor Devices.
- Over 25 years of business and technology experience, specifically semiconductor fabrication, including executive positions at Aixtron SE (2014-2017), Eugenus (2017-present) and Yield Engineering Systems (May 2018 – present).
- Co-editor, Silicon Compatible Materials, Processes, and Technologies For Advanced Integrated Circuits and Emerging Applications (2016, 2018), with Fred Roozeboom, K. Kakushima, et al. Publisher: The Electrochemical Society.
- Co-editor, Surface Studies of III-V Materials: Oxidation Control and Device Implications (2009), with C.L. Hinkle, M. Milojevic, et al. Publisher: University of Texas at Dallas
- Author or co-author of over 40 articles in industry and technical publications, including Journal of Applied Physics, IEEE Transactions on Electron Devices, Applied Physics Letters, Journal of Crystal Growth (1991 to present)
- Helped to create technology and necessary ecosystem for III-V (GaAs, InP, InGaAs..) and GaN in Logic and Power applications. Led groups to help create necessary technologies for ALD applications – now the standard within the semi industry.
- Grew revenue greater than 2x market growth, drove development of at least two semiconductor equipment platforms (ALD and epi) – the most successful in company’s history.
- Named one of the “25 Most Influential People in the North American Heat Treating Industry” (The Monty).
- Owns 14 patents.
Links to Online Resources
- Antiferroelectricity in Lanthanum Doped Zirconia Without Metallic Capping Layers and Post-Deposition/-Metallization Anneal. (2018), with Nujhat Tasneem, in Applied Physics Letters.
- A Compact Model for Metal – Oxide Resistive Random Access Memory With Experiment Verification with Jane Zizhen Jiang, Yi Wu, et al, in IEEE Transactions on Electron Devices
- Silicon Compatible Materials, Processes, and Technologies For Advanced Integrated Circuits and Emerging Applications
References available from the consultant